National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| ROM/PROM FAMILY 237 | 16236 | A | 5 | 1 | 9 | ZZ | ||
| 952644 | 49956 | A | 5 | 9 | 1 | HD | ||
| 952644-101B | 49956 | A | 5 | 9 | 1 | HD | ||
| 952644 | 3B150 | A | 7 | 1 | 1 | HD | ||
| 952644-101B | 3B150 | A | 3 | 2 | 1 | HD | ||
| HM1-7620-8 | 34371 | A | 5 | 9 | 5 | HD | ||
| M5305-1D/883B | 50364 | F | 5 | 1 | 5 | HD | ||
| S82S130F/883B | 18324 | A | 5 | 1 | 5 | HD |
CAGE Information
| Code | Company |
|---|---|
| 16236 | DLA LAND AND MARITIME |
| 49956 | RAYTHEON COMPANY DBA RAYTHEON |
| 3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
| 34371 | INTERSIL CORPORATION |
| 50364 | MMI/AMD |
| 18324 | PHILIPS SEMICONDUCTORS INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CRHL | BIT QUANTITY (NON-CORE) | 2048 |
| ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | SILICON |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
| CSWJ | WORD QUANTITY (NON-CORE) | 512 |
| CZER | MEMORY DEVICE TYPE | ROM |
| CBBL | FEATURES PROVIDED | BIPOLAR AND HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMED AND W/OPEN COLLECTOR |
| CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |