National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| D2708-1 | 34649 | A | E | 8 | 6 | TX | ||
| 810-1-200695-1 | 50237 | A | E | 8 | 6 | TX | ||
| AM2708DC | 34335 | A | 5 | 9 | 6 | TX | ||
| AM9708DM | 34649 | A | 5 | 1 | 5 | TX | ||
| TMS2708JL | 01295 | A | E | 8 | E | TX | ||
| B2708-1 | 34649 | A | E | 8 | 1 | TX | ||
| TMS2708 | 07263 | A | 5 | 9 | 4 | 9Z | ||
| 2708 | 07263 | A | C | 1 | 6 | ZZ | AC | |
| ROM/PROM HEAD 014 | 16236 | A | 5 | 1 | 5 | TX | ||
| TMS2708 | 02763 | A | C | 1 | 6 | TX | AW | |
| 5013416 | 53711 | A | C | 1 | 6 | ZZ | AC | |
| 810-1-200695 | 50237 | A | E | 8 | A | TX | ||
| SMJ2708-45JL | 01295 | A | 3 | 9 | E | TX | ||
| TMS2708-45JL | 01295 | A | 5 | 1 | 6 | TX | ||
| 810-1-200696 | 50237 | A | E | 8 | 5 | TX | ||
| 5218-162 | 05869 | A | 5 | 1 | 5 | TX | ||
| DMS 86003B | 16236 | A | 5 | 9 | 9 | TX | ||
| N82S2708F | 18324 | A | C | 1 | 5 | TX | AF | |
| V3724-Z8708-X2 | S3120 | A | 5 | 2 | 3 | ZG |
CAGE Information
| Code | Company |
|---|---|
| 01295 | TEXAS INSTRUMENTS INCORPORATED DBA T |
| 34649 | INTEL CORP SALES OFFICE |
| 50237 | CAE USA INC. DIV SIMULATOR PRODUCTS |
| 34335 | ADVANCED MICRO DEVICES, INC. DBA A M |
| 07263 | FAIRCHILD SEMICONDUCTOR CORP |
| 16236 | DLA LAND AND MARITIME |
| 02763 | GRIPPE MACHINING AND MANUFACTURING C |
| 53711 | NAVAL SEA SYSTEMS COMMAND |
| 05869 | RAYTHEON COMPANY DBA RAYTHEON |
| 18324 | PHILIPS SEMICONDUCTORS INC |
| S3120 | SIEMENS SCHWEIZ AG DBA SIEMENS SWITZ |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
| CRHL | BIT QUANTITY (NON-CORE) | 8192 |
| CQZP | INPUT CIRCUIT PATTERN | 12 INPUT |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 580.0 MILLIWATTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| AFJQ | STORAGE TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| ADAU | BODY HEIGHT | 0.180 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | MEMORY DEVICE TYPE | ROM |
| CSWJ | WORD QUANTITY (NON-CORE) | 1024 |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND W/STORAGE |
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,
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