National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
HM1-7621-8 | 34371 | A | 5 | 9 | 3 | TX | ||
S82S131F/883B | 18324 | A | 5 | 1 | 3 | TX | ||
5306-1D | 50364 | F | 5 | 1 | 3 | TX | ||
952369-19 | 49956 | A | 5 | 9 | 1 | TX | ||
952369-19 | 3B150 | A | 3 | 2 | 1 | TX | ||
CC2270F | 18324 | A | 5 | 1 | 5 | TX |
CAGE Information
Code | Company |
---|---|
18324 | PHILIPS SEMICONDUCTORS INC |
34371 | INTERSIL CORPORATION |
50364 | MMI/AMD |
49956 | RAYTHEON COMPANY DBA RAYTHEON |
3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | RADAR SET,TYPE AN/FPS-115 |
CRHL | BIT QUANTITY (NON-CORE) | 2048 |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
ADAU | BODY HEIGHT | 0.140 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | W/DECODED OUTPUT AND HERMETICALLY SEALED AND 3-STATE OUTPUT AND MONOLITHIC AND POSITIVE OUTPUTS AND NEGATIVE OUTPUTS AND W/ENABLE AND W/BUFFERED OUTPUT AND PROGRAMMABLE |
AEHX | MAXIMUM POWER DISSIPATION RATING | 715.0 MILLIWATTS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
TEST | TEST DATA DOCUMENT | 49956-952369 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
ADAQ | BODY LENGTH | 0.840 INCHES MAXIMUM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-2 MIL-M-38510 |
CSWJ | WORD QUANTITY (NON-CORE) | 512 |
CZEQ | TIME RATING PER CHACTERISTIC | ERR-060 NOMINAL HAND PULL AND ERR-060 NOMINAL HAND |
CZER | MEMORY DEVICE TYPE | ROM |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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CC2270F ,
CC2270F ,
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011053659
,
HM1-7621-8 ,
S82S131F/883B ,
5306-1D ,
952369-19 ,
952369-19 ,
CC2270F ,