National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
G275700-1 | 49956 | A | 5 | 9 | 5 | TX | ||
S82S153 | 18324 | A | 5 | 1 | 5 | TX | ||
82S153A | 18324 | A | 5 | 1 | E | TX | ||
PRG275700-1 | 3B150 | A | 5 | 1 | 5 | TX | ||
PRG275700-1 | 49956 | A | 5 | 9 | 5 | TX | ||
G275700-1 | 3B150 | A | 3 | 2 | 5 | TX | ||
ROM/PROM FAMILY 158 | 16236 | A | 5 | 1 | 9 | ZZ |
CAGE Information
Code | Company |
---|---|
16236 | DLA LAND AND MARITIME |
49956 | RAYTHEON COMPANY DBA RAYTHEON |
18324 | PHILIPS SEMICONDUCTORS INC |
3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 0.898 INCHES MAXIMUM |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
ADAT | BODY WIDTH | 0.216 INCHES MINIMUM AND 0.334 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | PAL |
ADAU | BODY HEIGHT | 0.200 INCHES NOMINAL |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.0 VOLTS NOMINAL POWER SOURCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |