National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
8103509RX | 14933 | R | C | 1 | E | TX | AF | |
81035 | 67268 | A | 4 | 1 | E | TX | ||
8103509RA | 67268 | A | 2 | 2 | E | TX | ||
5962-8103509BRB | 67268 | A | 5 | 9 | E | TX | ||
5962-8103509BRX | 67268 | A | 5 | 9 | E | TX | ||
DMPAL16L2J/883 | 27014 | A | 5 | 1 | E | TX | ||
5962-8103509BRA | 67268 | A | 5 | 1 | E | TX | ||
PAL16L2MJ/883 | 50364 | F | 5 | 1 | E | TX | ||
ROM/PROM HEAD 074 | 14933 | R | 5 | 1 | 9 | TX | ||
624185-10 | 80020 | A | C | 1 | 5 | TX | AF |
CAGE Information
Code | Company |
---|---|
14933 | DEFENSE ELECTRONICS SUPPLY CENTER |
67268 | DLA LAND AND MARITIME OPNS SUPPORT G |
27014 | NATIONAL SEMICONDUCTOR CORPORATION |
50364 | MMI/AMD |
80020 | NAVAL AIR WARFARE CENTER AIRCRAFT DI |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CTQX | CURRENT RATING PER CHARACTERISTIC | 100.00 MILLIAMPERES NOMINAL OUTPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-8 MIL-M-38510 |
TTQY | TERMINAL TYPE AND QUANTITY | 20 PRINTED CIRCUIT |
AEHX | MAXIMUM POWER DISSIPATION RATING | 2.0 WATTS |
CZEQ | TIME RATING PER CHACTERISTIC | 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 45.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | PAL |
CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
ADAQ | BODY LENGTH | 1.060 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CBBL | FEATURES PROVIDED | BURN IN AND MONOLITHIC AND BIPOLAR AND HERMETICALLY SEALED AND PROGRAMMABLE |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 12.0 VOLTS MAXIMUM POWER SOURCE |
ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.185 INCHES MAXIMUM |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |