National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
1601LMQB70 | 07263 | A | 5 | 1 | 5 | TX | ||
SCD3000 | 61772 | A | 5 | 1 | 5 | TX | ||
7567652-004 | 13160 | A | 3 | 2 | A | TX | ||
IMS1600N-70M | 60911 | F | 5 | 9 | 5 | TX | ||
IMS1600W-70M | 60911 | F | 5 | 9 | 5 | TX | ||
IMS1601W-70M | 60911 | F | 5 | 9 | 5 | TX |
CAGE Information
Code | Company |
---|---|
07263 | FAIRCHILD SEMICONDUCTOR CORP |
61772 | INTEGRATED DEVICE TECHNOLOGY INC |
13160 | GENERAL DYNAMICS LAND SYSTEMS INC. D |
60911 | SGS-THOMSON MICROELECTRONICS INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
CBBL | FEATURES PROVIDED | MONOLITHIC AND ELECTROSTATIC SENSITIVE |
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 0.496 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
TTQY | TERMINAL TYPE AND QUANTITY | 22 LEADLESS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
CRHL | BIT QUANTITY (NON-CORE) | 256 |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CZER | MEMORY DEVICE TYPE | RAM |
ADAT | BODY WIDTH | 0.296 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.080 INCHES MAXIMUM |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CSWJ | WORD QUANTITY (NON-CORE) | 256 |
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