National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| 717801483-001 | 04939 | A | 3 | 2 | A | TX | ||
| IDT7132LA70L52B | 61772 | A | 5 | 9 | 6 | TX | ||
| CY7C136-55LMB | 65786 | A | 5 | 1 | E | TX | ||
| IDT7132L70LB52 | 61772 | A | 5 | 1 | E | TX | ||
| CY7C136-55JI | 65786 | A | 5 | 1 | 3 | ZZ | ||
| IDT71321SA55L52B | 61772 | A | C | 1 | 1 | ZZ | AC |
CAGE Information
| Code | Company |
|---|---|
| 04939 | LOCKHEED MARTIN CORPORATION DBA LOCK |
| 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
| 65786 | CYPRESS SEMICONDUCTOR CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BURN IN AND ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC |
| CRHL | BIT QUANTITY (NON-CORE) | 2048 |
| CQZP | INPUT CIRCUIT PATTERN | 37 INPUT |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| ABHP | OVERALL LENGTH | 0.761 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.761 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| ADAT | BODY WIDTH | 0.761 INCHES MAXIMUM |
| CQSJ | INCLOSURE MATERIAL | GLASS OR CERAMIC OR METAL |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-6 MIL-M-38510 |
| ADAQ | BODY LENGTH | 0.761 INCHES MAXIMUM |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | RAM |
| ABKW | OVERALL HEIGHT | 0.120 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.088 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 52 LEADLESS |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CSWJ | WORD QUANTITY (NON-CORE) | 256 |