National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| NH636784-03 | 16236 | A | 5 | 1 | 5 | ZZ | ||
| 636784-03 | 07690 | A | 3 | 2 | A | ZZ | ||
| IDT6116LA25TDBRT | 61772 | A | 5 | 1 | E | ZZ |
CAGE Information
| Code | Company |
|---|---|
| 07690 | BAE SYSTEMS CONTROLS INC |
| 16236 | DLA LAND AND MARITIME |
| 61772 | INTEGRATED DEVICE TECHNOLOGY INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| ADAQ | BODY LENGTH | 1.180 INCHES MINIMUM AND 1.230 INCHES MAXIMUM |
| NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | STATIC RAM |
| CBBL | FEATURES PROVIDED | HIGH PERFORMANCE AND STATIC OPERATION AND HIGH SPEED AND LOW POWER AND BIDIRECTIONAL AND HIGH RELIABILITY |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CRHL | BIT QUANTITY (NON-CORE) | 16384 |
| ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| CZER | MEMORY DEVICE TYPE | RAM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CSWJ | WORD QUANTITY (NON-CORE) | 2048 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 105.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
| CZEQ | TIME RATING PER CHACTERISTIC | 25.00 NANOSECONDS MAXIMUM ACCESS |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
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636784-03 ,
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,
NH636784-03 ,
636784-03 ,
IDT6116LA25TDBRT ,