National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
---|---|---|---|---|---|---|---|---|
ROM/PROM HEAD 246 | 16236 | A | 5 | 1 | 9 | ZZ | ||
5962-3820702BFA | 81349 | M | 5 | 1 | E | ZZ | ||
82S123/BFA | 18324 | A | 5 | 1 | E | ZZ | ||
M38510/20702BFB | 81349 | M | 5 | 9 | E | ZZ | ||
M38510/20702BFX | 81349 | M | 5 | 9 | E | ZZ | ||
MIL-M-38510/207 | 81349 | M | 4 | 1 | E | ZZ | ||
M38510/20702BFA | 81349 | M | 2 | 2 | E | ZZ |
CAGE Information
Code | Company |
---|---|
16236 | DLA LAND AND MARITIME |
81349 | MILITARY SPECIFICATIONS PROMULGATED |
18324 | PHILIPS SEMICONDUCTORS INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION |
CTQX | CURRENT RATING PER CHARACTERISTIC | 130.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE |
CSWJ | WORD QUANTITY (NON-CORE) | 32 |
ADAT | BODY WIDTH | 0.285 INCHES MAXIMUM |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-5 MIL-M-38510 |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CRHL | BIT QUANTITY (NON-CORE) | 256 |
ADAU | BODY HEIGHT | 0.085 INCHES MAXIMUM |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CZER | MEMORY DEVICE TYPE | PROM |
CBBL | FEATURES PROVIDED | SCHOTTKY AND BIPOLAR AND 3-STATE OUTPUT AND PROGRAMMABLE AND HIGH IMPEDANCE |
CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/207 GOVERNMENT SPECIFICATION |
CZEQ | TIME RATING PER CHACTERISTIC | 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT AND 80.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
ADAQ | BODY LENGTH | 0.440 INCHES MAXIMUM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
AEHX | MAXIMUM POWER DISSIPATION RATING | 739.0 MILLIWATTS |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |