National Stock Number (NSN) Output Data
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
Reference/Part Number
| Part Number | CAGE | Status | RNCC | RNVC | DAC | RNAAC | MSDS | SADC |
|---|---|---|---|---|---|---|---|---|
| VG021085-011 | 51215 | A | 3 | 2 | 2 | ZZ |
CAGE Information
| Code | Company |
|---|---|
| 51215 | BOEING COMPANY THE DBA BOEING DIV DE |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS MAXIMUM ACCESS |
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| FEAT | SPECIAL FEATURES | ALTERED ITEM MADE FROM 67268 5962-8953702YX;CASE OUTLINE SOURCE AND DESIGNATOR IS MIL-STD-1835 CDIP3-T28 OR GDIP4-T28 |
| CZER | MEMORY DEVICE TYPE | EPROM |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
| ADAT | BODY WIDTH | 0.225 INCHES MAXIMUM |
| CRHL | BIT QUANTITY (NON-CORE) | 131072 |
| ADAQ | BODY LENGTH | 1.485 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
| CZEP | CAPITANCE RATING PER CHARACTERISTIC | 10.00 INPUT PICOFARADS MAXIMUM AND 10.00 OUTPUT PICOFARADS MAXIMUM |
| CRTL | CRITICALITY CODE JUSTIFICATION | CBBL |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | AGM 130 |
| CBBL | FEATURES PROVIDED | BEAM LEAD CHIP AND BURN IN, MIL-STD-883, CLASS B AND ERASABLE AND TESTED TO MIL-STD-883 AND PROGRAMMED AND MONOLITHIC AND ULTRAVIOLET ERASABLE |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT-ERASEABLE PROGRAMMABLE READ ONLY MEMORY |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-15 MIL-M-38510 |
| CSWJ | WORD QUANTITY (NON-CORE) | 16384 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 120.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE AND 35.00 MILLIAMPERES REVERSE CURRENT, DC BLANK |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD |
| ADAU | BODY HEIGHT | 0.240 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE AND -3.0 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |