Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT SET
Definition:
A GROUPING OF TWO OR MORE SEPARATE MICROCIRCUITS, (AS MODIFIED) WHICH MAY OR MAY NOT BE MATCHED TOGETHER FOR CHARACTERISTIC(S). FOR ITEMS HAVING A COMMON MOUNTING OR MOUNTED ON EACH OTHER, SEE MICROCIRCUIT ASSEMBLY. EXCLUDES SEMICONDUCTOR DEVICE SET.
CAGE Information
Code | Company |
---|---|
04939 | LOCKHEED MARTIN CORPORATION DBA LOCK |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM APPLIED AND 7.0 VOLTS MAXIMUM APPLIED |
CZEQ | TIME RATING PER CHACTERISTIC | 10.00 NANOSECONDS MAXIMUM PROPAGATION DELAY |
CZER | MEMORY DEVICE TYPE | PAL |
AGAV | END ITEM IDENTIFICATION | HU ;LANTIRN |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 MEMORY, PROGRAMMED ARRAY LOGIC |
CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
CZEM | MICROCIRCUIT DEVICE TYPE AND QUANTITY | 2 MEMORY |
ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
TTQY | TERMINAL TYPE AND QUANTITY | 28 LEADLESS |