Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
CAGE Information
Code | Company |
---|---|
3B150 | RAYTHEON TECHNICAL SERVICES COMPANY |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
ADAQ | BODY LENGTH | 0.350 INCHES MINIMUM AND 0.400 INCHES MAXIMUM |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
ADAT | BODY WIDTH | 0.200 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
CSWJ | WORD QUANTITY (NON-CORE) | 16 |
CBBL | FEATURES PROVIDED | HIGH SPEED AND MONOLITHIC AND SCHOTTKY AND 3-STATE OUTPUT AND W/ENABLE AND POSITIVE OUTPUTS AND HERMETICALLY SEALED AND W/DISABLE |
CRHL | BIT QUANTITY (NON-CORE) | 64 |
ADAU | BODY HEIGHT | 0.008 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
CZZZ | MEMORY CAPACITY | UNKNOWN |
CZER | MEMORY DEVICE TYPE | RAM |
TTQY | TERMINAL TYPE AND QUANTITY | 16 FLAT LEADS |
CQZP | INPUT CIRCUIT PATTERN | 10 INPUT |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | -0-004-AG JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |