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Part Number

Part Number:
NSN:
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Item Name:
MICROCIRCUIT , DIGITAL

Definition:

A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".

CAGE Information

Code Company
12040 NATIONAL SEMICONDUCTOR CORP

Federal Supply Class

Title

MICROCIRCUITS, ELECTRONIC

Inclusions:

INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.

Exclusions:

EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
CQZP INPUT CIRCUIT PATTERN DUAL 2 INPUT AND QUAD 1 INPUT
ADAQ BODY LENGTH 0.870 INCHES MAXIMUM
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE
TEST TEST DATA DOCUMENT 15786-304239 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING)
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CQSJ INCLOSURE MATERIAL CERAMIC
CZEQ TIME RATING PER CHACTERISTIC 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
TTQY TERMINAL TYPE AND QUANTITY 16 PRINTED CIRCUIT
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BURN IN, MIL-STD-883, CLASS B AND MONOLITHIC AND POSITIVE OUTPUTS
AGAV END ITEM IDENTIFICATION AN/ALR62 15786
ADAT BODY WIDTH 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM
ADAU BODY HEIGHT 0.185 INCHES MAXIMUM
CSSL DESIGN FUNCTION AND QUANTITY 2 BUFFER, NAND AND 4 INVERTER
CWSG TERMINAL SURFACE TREATMENT SOLDER

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