Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
CAGE Information
| Code | Company |
|---|---|
| 15818 | TELCOM SEMICONDUCTOR INC |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| CBBL | FEATURES PROVIDED | MONOLITHIC AND NEGATIVE OUTPUTS AND HERMETICALLY SEALED AND POSITIVE OUTPUTS |
| TTQY | TERMINAL TYPE AND QUANTITY | 12 PIN |
| ADAU | BODY HEIGHT | 0.145 INCHES MINIMUM AND 0.185 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | +0.0/+70.0 DEG CELSIUS |
| CZEQ | TIME RATING PER CHACTERISTIC | 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 25.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
| CQSJ | INCLOSURE MATERIAL | GLASS AND METAL |
| CQWX | OUTPUT LOGIC FORM | DIRECT-COUPLED-TRANSISTOR LOGIC |
| TEST | TEST DATA DOCUMENT | 10001-2558142 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS, BROCHURES,ETC., THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS, INDUSTRY DIRECTORIES, AND SIMILAR TRADE PUBLICATIONS, REFLECTING GENERAL TYPE DATA ON CERTAIN ENVIRONMENTAL AND PERFORMANCE REQUIREMENTS AND TEST CONDITIONS THAT ARE SHOWN AS "TYPICAL |
| CQZP | INPUT CIRCUIT PATTERN | 7 INPUT |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 4.0 VOLTS MAXIMUM POWER SOURCE |
| ADAR | BODY OUTSIDE DIAMETER | 0.335 INCHES MINIMUM AND 0.370 INCHES MAXIMUM |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 FLIP-FLOP, J-K |
| CQSZ | INCLOSURE CONFIGURATION | CAN |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |