Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
CAGE Information
| Code | Company |
|---|---|
| 81349 | MILITARY SPECIFICATIONS PROMULGATED |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION |
| ADAU | BODY HEIGHT | 0.064 INCHES MINIMUM AND 0.078 INCHES MAXIMUM |
| CSWJ | WORD QUANTITY (NON-CORE) | 65536 |
| ADAT | BODY WIDTH | 0.284 INCHES MINIMUM AND 0.296 INCHES MAXIMUM |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 FLAT LEADS |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 50.00 MILLIAMPERES FORWARD CURRENT, MAXIMUM PEAK TOTAL VALUE NOT APPLICABLE |
| ADAQ | BODY LENGTH | 0.484 INCHES MINIMUM AND 0.496 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 5.5 VOLTS MAXIMUM POWER SOURCE |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| ZZZK | SPECIFICATION/STANDARD DATA | 81349-MIL-M-38510/292 GOVERNMENT SPECIFICATION |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CRHL | BIT QUANTITY (NON-CORE) | 65536 |
| CQSZ | INCLOSURE CONFIGURATION | LEADLESS FLAT PACK |
| CZER | MEMORY DEVICE TYPE | RAM |
| CBBL | FEATURES PROVIDED | BURN IN AND HERMETICALLY SEALED AND STATIC OPERATION AND MONOLITHIC |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |