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Part Number

Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL

Definition:

A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".

CAGE Information

Code Company
18324 PHILIPS SEMICONDUCTORS INC

Federal Supply Class

Title

MICROCIRCUITS, ELECTRONIC

Inclusions:

INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.

Exclusions:

EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
CQSZ INCLOSURE CONFIGURATION DUAL-IN-LINE
CZEQ TIME RATING PER CHACTERISTIC 15.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 22.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
ADAT BODY WIDTH 0.245 INCHES MINIMUM AND 0.280 INCHES MAXIMUM
ADAQ BODY LENGTH 0.755 INCHES MINIMUM AND 0.785 INCHES MAXIMUM
TTQY TERMINAL TYPE AND QUANTITY 14 PRINTED CIRCUIT
AEHX MAXIMUM POWER DISSIPATION RATING 40.0 MILLIWATTS
CBBL FEATURES PROVIDED BURN IN AND POSITIVE OUTPUTS AND MONOLITHIC AND HERMETICALLY SEALED AND ELECTROSTATIC SENSITIVE
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CTFT CASE OUTLINE SOURCE AND DESIGNATOR -0-001AA JOINT ELECTRON DEVICE ENGINEERING COUNCIL
CQSJ INCLOSURE MATERIAL CERAMIC
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
CQZP INPUT CIRCUIT PATTERN 8 INPUT
ADAU BODY HEIGHT 0.180 INCHES MAXIMUM
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.).
CSSL DESIGN FUNCTION AND QUANTITY 1 GATE, NAND
CWSG TERMINAL SURFACE TREATMENT SOLDER

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