Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL
Definition:
A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".
CAGE Information
Code | Company |
---|---|
14433 | ITT SEMICONDUCTORS DIV |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
MRC | Requirements Statement | Clear Text Reply |
---|---|---|
AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
CQWX | OUTPUT LOGIC FORM | DIODE-TRANSISTOR LOGIC |
TEST | TEST DATA DOCUMENT | 99971-7528378 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
ADAT | BODY WIDTH | 0.240 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
CZEQ | TIME RATING PER CHACTERISTIC | 50.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 35.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
ADAU | BODY HEIGHT | 0.030 INCHES MINIMUM AND 0.080 INCHES MAXIMUM |
CBBL | FEATURES PROVIDED | EXPANDABLE AND HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND MEDIUM SPEED |
AEHX | MAXIMUM POWER DISSIPATION RATING | 200.0 MILLIWATTS |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
CQZP | INPUT CIRCUIT PATTERN | DUAL 4 INPUT |
ADAQ | BODY LENGTH | 0.240 INCHES MINIMUM AND 0.265 INCHES MAXIMUM |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CSSL | DESIGN FUNCTION AND QUANTITY | 2 GATE, NAND-NOR |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |