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Part Number

Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY

Definition:

A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.

CAGE Information

Code Company
50364 MMI/AMD

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
ADAQ BODY LENGTH 0.358 INCHES MAXIMUM
ADAT BODY WIDTH 0.358 INCHES MAXIMUM
CZEQ TIME RATING PER CHACTERISTIC 45.00 NANOSECONDS MAXIMUM DELAY
CBBL FEATURES PROVIDED HERMETICALLY SEALED AND BIPOLAR AND BURN IN AND MONOLITHIC
AEHX MAXIMUM POWER DISSIPATION RATING 2.0 WATTS
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-2 MIL-M-38510
CZER MEMORY DEVICE TYPE PAL
CQSJ INCLOSURE MATERIAL CERAMIC
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
CQZP INPUT CIRCUIT PATTERN 16 INPUT
CQWX OUTPUT LOGIC FORM TRANSISTOR-TRANSISTOR LOGIC
ADAU BODY HEIGHT 0.100 INCHES MAXIMUM
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD
CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK
TTQY TERMINAL TYPE AND QUANTITY 20 LEADLESS
CWSG TERMINAL SURFACE TREATMENT SOLDER

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