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Part Number

Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY

Definition:

A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.

CAGE Information

Code Company
50364 MMI/AMD

Federal Supply Class

Title

MICROCIRCUITS, ELECTRONIC

Inclusions:

INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.

Exclusions:

EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
PRMT PRECIOUS MATERIAL GOLD
ADAQ BODY LENGTH 0.350 INCHES MAXIMUM
AEHX MAXIMUM POWER DISSIPATION RATING 0.6 WATTS
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CTFT CASE OUTLINE SOURCE AND DESIGNATOR C-2 MIL-M-38510
CQWX OUTPUT LOGIC FORM BIPOLAR METAL-OXIDE SEMICONDUCTOR
CZER MEMORY DEVICE TYPE PAL
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC 7.0 VOLTS MAXIMUM POWER SOURCE
CQZP INPUT CIRCUIT PATTERN 16 INPUT
CQSZ INCLOSURE CONFIGURATION LEADED CHIP CARRIER
CQSJ INCLOSURE MATERIAL METAL OR PLASTIC OR CERAMIC
PMLC PRECIOUS MATERIAL AND LOCATION TERMINAL SURFACE OPTION GOLD
TEST TEST DATA DOCUMENT 96906-MIL-STD-883 STANDARD
ADAT BODY WIDTH 0.350 INCHES MAXIMUM
CTQX CURRENT RATING PER CHARACTERISTIC 12.00 MILLIAMPERES REVERSE CURRENT, DC ABSOLUTE
TTQY TERMINAL TYPE AND QUANTITY 20 FLAT LEADS
CBBL FEATURES PROVIDED BIPOLAR AND MONOLITHIC AND PROGRAMMABLE
CWSG TERMINAL SURFACE TREATMENT SOLDER

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