Part Number
Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , MEMORY
Definition:
A CIRCUIT DESIGNED TO STORE INFORMATION AND/OR CODED INSTRUCTIONS FOR LATER USE. ITEM HAS PINS OR OTHER CONNECTIONS TO INSTALL IN A COMPUTER OR COMPUTING DEVICE. DOES NOT INCLUDE MAGNETIC DRUMS, TAPES, PUNCHED CARDS OR THE LIKE. FOR ITEMS THAT HAVE PORTABLE TYPE CONNECTIONS SEE MEMORY, PORTABLE, SOLID STATE.
CAGE Information
| Code | Company |
|---|---|
| 34371 | INTERSIL CORPORATION |
Federal Supply Class
Title
MICROCIRCUITS, ELECTRONIC
Inclusions:
INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.
Exclusions:
EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.
Characteristics (Decoded)
| MRC | Requirements Statement | Clear Text Reply |
|---|---|---|
| AFGA | OPERATING TEMP RANGE | -55.0/+125.0 DEG CELSIUS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC OR GLASS OR METAL |
| ADAU | BODY HEIGHT | 0.045 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.150 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 450.0 MILLIWATTS |
| TEST | TEST DATA DOCUMENT | 13973-861540 DRAWING |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| TTQY | TERMINAL TYPE AND QUANTITY | 14 FLAT LEADS |
| AFJQ | STORAGE TEMP RANGE | -65.0/+150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED |
| ADAQ | BODY LENGTH | 0.260 INCHES MAXIMUM |
| CQZP | INPUT CIRCUIT PATTERN | 6 INPUT |
| CZER | MEMORY DEVICE TYPE | DIODE MATRIX |
| CQWX | OUTPUT LOGIC FORM | DIODE LOGIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |