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Part Number

Part Number:
NSN:
NIIN:
Item Name:
BACKPLANE ASSEMBLY

Definition:

AN INSULATING PANEL UPON WHICH TWO OR MORE CONNECTOR, RECEPTACLE, ELECTRICAL, ARE MOUNTED, AND COMPLETELY PROCESSED ELECTRICAL CONDUCTOR PATHS ARE DEPOSITED, ETCHED, OR PRINTED IN VARIOUS PATHS. IT PROVIDES OR COMPLETES A CIRCUIT BETWEEN TWO OR MORE CIRCUIT CARD ASSEMBLY OR ELECTRONIC COMPONENTS ASSEMBLY. IT MAY BE DESIGNED FOR PANEL OR CHASSIS MOUNTING, OR FOR INSERTION INTO A CONNECTOR, RECEPTACLE, ELECTRICAL. INCLUDES MOTHERBOARDS. FOR ITEMS CONTAINING PROCESSED ELECTRICAL CONDUCTOR PATHS AND CONTACTS FOR PLUG-IN CONNECTING FACILITIES, SEE PRINTED WIRING BOARD. SEE ALSO PRINTED CIRCUIT BOARD; CIRCUIT CARD ASSEMBLY AND CABLE ASSEMBLY, PRINTED, FLEXIBLE.

CAGE Information

Code Company
0ZR33 ZETA ASSOCIATES INCORPORATED

Federal Supply Class

Title

ELECTRICAL AND ELECTRONIC ASSEMB

Inclusions:

Exclusions:

EXCLUDES CIRCUIT CARD AND ELECTRONIC COMPONENT ASSEMBLIES WHICH CAN BE IDENTIFIED TO A MORE DEFINITIVE APPROVED ITEM NAME.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
FEAT SPECIAL FEATURES CHIPSET: INTEL E7501 AND ICH3-S; MEMORY: UP TO 4GB DDR 266/200 SDRAM ON TWO 184-PIN DIMM SOCKETS; ETHERNET: INTEL 82546EB PCI-X DUAL PORT GIGABIT ETHERNET CONTOLLER, TWO RJ-45 CONNECTOR WITH TWO LED INDICATORS FOR LAN ACCESS AND LINK STATUS; ACPI FUNCTION: ATX POWER SUPPLY CONTROL VIA BLACKPLANE; OPERATING TEMPERATURE: 0 TO 60 DEG CEL; STORAGE TEMPERATURE: -40 TO 75 DEG CEL.
CXCY PART NAME ASSIGNED BY CONTROLLING AGENCY DUAL INTEL XEON PROCESSOR BASE PICMG 1.2 (EPCI-X) SHB WITH VGA AND DUAL GIGABIT ETHERNET
ABMK OVERALL WIDTH 4.800 INCHES NOMINAL
AGAV END ITEM IDENTIFICATION AN/USD 9B,C,D,E
ABHP OVERALL LENGTH 13.330 INCHES NOMINAL

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