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Part Number

Part Number:
NSN:
NIIN:
Item Name:
MICROCIRCUIT , DIGITAL

Definition:

A MICROCIRCUIT SPECIFICALLY DESIGNED TO GENERATE, MODIFY, OR PROCESS ELECTRICAL SIGNALS WHICH OPERATE WITH TWO DISTINCT OR BINARY STATES. THESE STATES ARE COMMONLY REFERRED TO AS ON AND OFF, TRUE AND FALSE, HIGH AND LOW, OR "1" AND "0".

CAGE Information

Code Company
0H4G4 VLSI TECHNOLOGY

Federal Supply Class

Title

MICROCIRCUITS, ELECTRONIC

Inclusions:

INCLUDES INTEGRATED CIRCUIT DEVICES; INTEGRATED CIRCUIT MODULES, INTEGRATED ELECTRONIC DEVICES: HYBRID, MAGNETIC, MOLECULAR, OPTO-ELECTRONIC, AND THIN FILM.

Exclusions:

EXCLUDES SINGLE CIRCUIT ELEMENTS SUCH AS CAPACITORS; RESISTORS; DIODES AND TRANSISTORS; PRINTED CIRCUIT BOARDS AND CIRCUIT CARD ASSEMBLIES; AND FILTERS AND NETWORKS.

Characteristics (Decoded)

MRC Requirements Statement Clear Text Reply
AFGA OPERATING TEMP RANGE -55.0/+125.0 DEG CELSIUS
TTQY TERMINAL TYPE AND QUANTITY 132 LEADLESS
AFJQ STORAGE TEMP RANGE -65.0/+150.0 DEG CELSIUS
CZEN VOLTAGE RATING AND TYPE PER CHARACTERISTIC -0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE
CQZP INPUT CIRCUIT PATTERN 55 INPUT
CQSJ INCLOSURE MATERIAL CERAMIC
CSSL DESIGN FUNCTION AND QUANTITY 1 PROCESSOR, INPUT/OUTPUT
CBBL FEATURES PROVIDED BURN IN AND ELECTROSTATIC SENSITIVE
CQWX OUTPUT LOGIC FORM COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC
CQSZ INCLOSURE CONFIGURATION LEADLESS FLAT PACK
CWSG TERMINAL SURFACE TREATMENT SOLDER

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